I'm using MPU6050 for a wearable application and the IC responds well at times but gives out 0 acceleration at times even though Device-ID is read correct always.
It is also found that, once I heat the IC with a hot air gun, it works again. In the datasheet provided by the link below, it is said under section 11.4 Assembly Precautions that the
exposed pad must not be soldered, but I have it soldered it in my target board and it is also mentioned that thermo-mechanical stress will affect the IC .
I also have a buzzer in my board, will it be as reason too?